IC One-Stop Services
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We are the most cost effective providers of IC Design-Packaging-Manufacturing Services. Contact us for a quick competitive quote. Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it.
IC Manufacturing Services
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SMT / DIP Manufacturing services include:
When you need a very cost-effective, yet flexibile surface mount technology "SMT" option, DallasIC's board assembly service gives you the extra care and attention you require for these essential boards. Our new SMT line offers the latest equipment and quality service at a fraction of traditional costs. With DallasIC you can be assured your project will be completed on time and with the standards and integrity you expect.
- Printed circuit board assembly; surface mount (SMT), through-hole and mixed technology
- Cable and wiring harness assemblies
- Complete product assembly, ready to ship, order fulfillment
- Automated conformal coating and potting
- Custom PCB and cable/wiring engineering and assembly solutions
- Turn-key and consignment services
- Complete BOM procurement and analysis
- Component Placement from 0402, 0201 to the smallest 01005
- 3D Stencil Process
- RoHS Process
- Lead-Free Process
- LF/NLF Mixed Process
- Customized Functional Testing
FlashChart
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- Published on Saturday, 17 March 2012 15:43
- Written by Super User
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IC Packaging Services
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Chip-On-Board / Chip-On-Flex / Bare Die Packaging
DallasIC's factory is a leading edge, integrated electronics manufacturing facility. In addition to conventional electronics assembly, we offer wire-bonding and flip-chip technology for chip-on-board and chip-on-flex applications. Utilizing bare die will ensure cost savings while effectively reducing the size of your next generation products.
Examples of DallasIC Die Packaging
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| Chip-on-Rigid-Flex | Chip-on-Board |
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| Chip-on-Flex | Chip-on-Flex |
DallasIC's broad bare die capabilities include:
- Bare die on any substrate - FR4, thin board, flex, rigid flex, exotic materials
- Die attach
- Gold wire bonding; gold or aluminum wedge bonding
- Encapsulation, glob-top or dam and fill
- Flip chip
- Underfill
IC Careers
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- Published on Saturday, 17 March 2012 15:04
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Physical Design Engineer
| Analog layout | Understanding of Analog Layout, understanding of process technology. |
| EDA | Proficiency with layout editor tool and all aspects of Physical verification. |
| Design knowledge | Good understanding of Design constraints and should be able to analyze the impact of layout on the circuit design. |
| Process technonlogy | Exposure to advanced technology nodes (40nm, 28nm) |
The candidate should possess strong engineering fundamentals. Should have a good understanding of Analog Layout. Should have an expertise in Physical verification flows (LVS/DRC) and parasitic extraction flow. Good understanding of process technology. Should have strong communication skills and ability to interact with multiple teams.
Working experience: 3- 5 years is desirable.
